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| UA2B200AX Contact Type Image Sensor 1.*@ Application This specification sheet is applied to Contact Type Image Sensor UA2B200AX. 2. General Description The UA2B200AX is a contact type image sensor with a valid pixel density of 200 DPI capable of scanning an image at the rate of 250 s/line for 200 mm width. The video signal is outputted at the 8-bit long digital value and is provided with black and white output correcting function for each pixel. 3. Specifications The specifications of this contact type image sensor are shown in the table below. Item Valid scanning width Pixel density Number of valid pixels Storing time Output clock frequency Valid scanning pixel White-basis output pixel Specifications 200mm 200dpi 1574 pixel (No. 2-1575 pixel) 16 pixel min (No. 1617-1632 pixel) 250 s/line 7.0MHz Total pixel: 1632 pixels Minimum number of pixels at maximum tolerance. Feed speed Maximum 7.5 MHz Remarks Sensor output width 207.4 mm (Including white-basis output) 4. Configuration The configuration of this contact type image sensor is shown in the table below. Item Optical system Configuration Rod lens array Blue *i = 470nm*j Green *i = 525nm*j Red *i = 655nm*j Infra-red *i = 940nm*j 5V x (0.5A) 45mAmax. 45mAmax. 35mAmax. 50mAmax. Remarks Angular aperture: 20 degrees (LED1,LED0)=(1,0) (LED1,LED0)=(0,1) (LED1,LED0)=(0,0) (LED1,LED0)=(1,1) TBD at LED On duty 1/4 Light source LED light source For sensor drive Blue Green For LED Red Infrared Power supply Data output mode Digital signal processing Block diagram Timing diagram Outline drawing 8-bit width digital output Black output correction by sensitiveness (pixel unit) White output correction by sensitiveness (pixel unit) Gain adjustment (PGA) Fig.1 Fig.2 Fig.4 TTL output PGA*F Programmable Gain*@ Amp. ( 1/6 ) UA2B200AX Contact Type Image Sensor *@ Fig. 1 *@ Internal block diagram LED Light Source Lod Lens Array 12 864 10bit ADC CIS Control Dark Correction Line memory PGA Timming Control White Correction Line memory Offset XSYNC_OUT VLED LED_GNDn XSYNC CIS_CLK Serial Control & Memory/Register Control LEDCn XDENB GND VDD LEDn EEPROM CN1 5. Standard Operating Conditions and Property Specifications This contact type image sensor shall satisfy the following characteristics. Characteristic specifications Item White output White output uniformity MTF Code DVp DUd % Specifications 60min. 0Amax. TBD Unit Hex HEX % Remarks Minimum white output value after black correction Deviation little to the black offset Resolution at scanning an original of 1.87 LP/mm using light source G Note) Only black correction is made for standard shipment and no white correction. ( 2/6 ) UA2B200AX Contact Type Image Sensor The measurement conditions of characteristic specifications are shown in the following. *@ Measurement Conditions of Property Specifications Item Power voltage Code VDD Red Green LED drive current ILED Blue Infra-Red White-basis chart Storing time Output clock rate Operating ambient temperature Trep fCIS_CLK Ta Specifications +5.0 30typ. 40typ. mA 40typ. 45typ. O.D. sec MHz C at LED On duty 1/4 Unit V Remarks 0.05 - 0.09 250.0 7.0 25 Note) 1) The definition of specification measurement item shall be as follows. The testing chart shall be placed in a stationary state at the scanning position shown in the outline drawing (Fig. 3) for scanning. 2) Specification measurement shall all be made after black correction. *@ Fig. 3 LED connection equivalent circuit VLED Blue Green Red IR 4-100Ohm(0.1W) for LED protect CONNECTOR 32 LED_GND0 34 36 38 LED_GND2 LED_GND3 LED_GND1 ( 3/6 ) UA2B200AX Contact Type Image Sensor 6. Timing Conditions Item Scanning cycle XSYNC effective period CIS_CLK cycle CIS_CLK duty Output line delay XSYNC_OUT effective width XSYNC_OUT setup time XSYNC_OUT hold time Data output delay time DATA setup time DATA hold time LED selection setup time LED selection hold time Code Trep Tw(XSYNC) TCIS_CLK *| Tldly Twxso Tsuxso Thdxso TDdly tDs tDh Tsu(LED) Thd(LED) 10 50 18 10 50 200 2 19 20 50 500 135 45 143 50 36 1 50 55 MIN TYP 250.0 MAX Unit sec nsec nsec % CIS_CLK CIS_CLK Remarks XSYNC 7.0MHz typ. nsec nsec CIS_CLK nsec nsec nsec sec Fig. 2 Timing conditions *j (Input) X S YC N Tsu() D EL S) X ( T w YC N T*i*DELj Trep En DL tldly (output) XST_UOYCN AD T XDENB LEDS*~16CIS_CLK 1,2,3,4 1632 LEDn*~16CIS_CLK n E CD L (output) I CS _ K L C tsuxso XST_UOYCN twxso AD T XDENB tDdly SKLC_ IT C tDs tDh thdxso not alid V 1 2 (Note) 1. This diagram is based on CIS_CLK. [clk] in the unit shows the number of CIS_CLKs. 2. XSYNC is valid only at falling * edge. 3. LEDS,LEDEn shows Register Values of CIS signal processing unit. ( 4/6 ) UA2B200AX Contact Type Image Sensor b) (Input) XSYNC LEDn (output) DATA XDENB Invalid LED0 LED1 LED2 LED3 LED0 Image data LED 0 Invalid Image data LED 1 Invalid Image data LED 2 InvalidImage data LED 3 green Invalid 7. 7.1 Connector Pin Arrangement CN1 (CIS control and signal output) CN1 pin arrangement Connector: SM40B-SRDS-G-TF (JST) Pin No. 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 Name Data0(LSB) Data2 GND Data4 Data6 GND CIS_CLK XSYNC_OUT VDD XSYNC XMW XUCS UCK UDI UDO VLED LED0 LED1 LEDC2 LEDC3 Pin No. 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Name Data1 Data3 GND Data5 Data7(MSB) GND GND XDENB VDD GND XME SELBUS GND LEDC0 LEDC1 LED_GND0 LED_GND1 LED_GND2 LED_GND3 FG ( 5/6 ) WDO l* |Q *}O*DR Depth DT *Q VDRU * TO}ODQ * * WDWj iQQ* * * UT}ODQ * * DVOD 5 * Q Q } * * TDS}ODT Q Q * * * 213.47 } * 0.5 *}O*DT UT}ODQ * * Outline drawing (Fig. 4) iTj * * OOi Sensor output Width j Q|* * * O}ODQ Q * * O}ODQ Q * * *}O*D 2 *}O*D 2 Contact Type Image Sensor XDOX |* * OODQ Q }* * O}ODQ Q * * DV}ODT *Q Q * * P" * O*DT }* O}ODQ Q * * QO*}O*DQ SDO * UDO * O*D 2 }* O}ODQ Q * * O}ODQ Q * * OODQ Q }* * iPDOj * * * Focus Piont PPDQR * *}O*DT White Basis DO *Q P*DT |* Q *}O*DQ *}O*D 2 U*DO SDO * O*D 2 }* Q*DO IMAGE SENSOR JAPAN UA2B20 0AX OOOOOP lw DO *Q rlSOa|r* qcrse f|* l w PT*DO VDRU * DVOD 5 * QQ }* * ( 6/6 ) TOODQ }* * UT}ODQ * * UT}ODQ * * *}O*D 3 T Q O*DT }* UA2B200AX |
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